["brand new and high quality\r\nFeatures:\r\nIt has high strength and fast bonding effect.\r\nUsed to paste heat sink with IC chips,and be cooling body with good thermal effect.\r\nIt is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation. It has good conductivity, wide temperature range (-60~200°C) and short-term resistance to 300°C.\r\nIn addition, it has short surface curing for time, strong bonding force, long storage period, non-toxic, solvent-free. \r\nIt can be safely applied in the elastic bonding, heat dissipation, insulation and packaging of electronics, electrical appliances, instruments, LEDs, heat sinks and other industries.\r\n\r\nInstructions:\r\n1. When using, directly extrude the product, rub the surface of the adherend, and cover it immediately after use, in for case of trial again;\r\n2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa;\r\n3. the recommended thickness of the application: 0.1-0.5mm, the thinner the better.\r\n4. Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean.\r\n\r\nSpecification:\r\nThermal conductivity: >0.671W/for m.k\r\nBreaking strength: 1.5MPA\r\nSurface vulcanization time: 10Min/25°C\r\nMaterial: Silicone\r\nCapacity: 5g\r\nLength: 52mm/2.05inch\r\nColor: As shown\r\nQuantity: 1 Pc\r\nNote: 1.Please allow 0-1cm error due to manual measurement. pls make sure you do not mind before you bid.\r\n 2.Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!\r\n\r\nPackage includes:\r\n1 x Thermal Silicone Adhesive"]