1、300℃ high temperature resistant in the short run, 250℃ high temperature resistant for a long time. 2、High extensibility that higher than 35% and high peel strength up to 5N/25mm enable this heat resistant adhesive tape to work for a very long time. 3、High insulation ensures the safety. 4、Adopting special adhesive with strong adhesive force to achieve no dirt left after peeling. 5、33m*0.55mm size makes the heat insulation adhesive tape suitable for BGA chip welding. Features: 300℃ high temperature resistant in the short run, 250℃ high temperature resistant for a long time. High extensibility that higher than 35% and high peel strength up to 5N/25mm enable this heat resistant adhesive tape to work for a very long time. High insulation ensures the safety. Adopting special adhesive with strong adhesive force to achieve no dirt left after peeling. 33m*0.55mm size makes the heat insulation adhesive tape suitable for BGA chip welding. Specification: Product type: Heat Insulation Adhesive Tape Thickness: approx. 0.06mm Length: approx. 33m Stretchability: ≥35% Peel strength: 5N/25mm Tensile force: 135N/25mm Temperature resistant: Long time: 250℃; Short time: 300℃ Width: 20mm, 30mm, 50mm for your choice Package size: approx. 9.5 * 9.5 * 2 cm/ 3.74 * 3.74 * 0.79 in Package weight: 47g Package List: 1 * Heat Insulation Adhesive Tape